Short Term Programs:

University of Florida Summer Program at Technion IL

gap year program in Israel

TAKE A BREAK and spend your summer in the Start-Up Nation. Enjoy the multicultural experiences of Israel while you earn 6 academic credits and get experience in an 8-week internship in a high-tech company.

Program dates: May 20 – August 2, 2018
Registration deadline:  March 30, 2018

PROGRAM

Technion International is pleased to invite you to the University of Florida Entrepreneurship & Internship Summer program at our campus in Israel. This is an 11-week, 6-credit combined study and internship program for undergraduate engineering students.

The 3-week entrepreneurship course will be focused on the innovation culture and practices in Israel. It will be taught by the Director of UF Engineering Innovation Institute, Mr. Erik Sander. This course equals 6 academic credits towards the Engineering Innovation Minor for undergraduates or the Engineering Entrepreneurship Certificate for graduate students.

In addition, students will participate in an 8-week internship in high-tech start-up companies closely related to their major field of study. Technion will coordinate the internship placement.

study in Israel for international students

WHY ISRAELIsrael has the highest concentration of high-tech companies anywhere in the world outside Silicon Valley.

Haifa is the third-largest city in the State of Israel after Jerusalem and Tel Aviv, and it is known for having some of the best beaches on the Mediterranean Sea. Haifa is also home to MATAM, the largest and oldest business park in Israel, which hosts a large number of Israeli and international high-tech companies, such as Intel, IBM, Microsoft, Motorola, Google, Yahoo, Wix, and Philips.

WHY TECHNION

Technion, consistently ranked among the world’s top 50 academic institutions, is a major source of the innovation and brainpower that drives the Israeli economy. Technion graduates, who represent 70 percent of the high-tech workforce, established Israel’s industrial infrastructure, reinforced its technological defense capabilities, and pioneered its technology-based enterprises that have earned the country its reputation as the world’s “Startup Nation.”

HOUSING AND EXCURSIONS

You will stay in Technion International’s on-campus housing. There will be organized tours to various locations throughout the country.

PRICING APPLICATION INFORMATION WHAT’S INCLUDED

A $350 nonrefundable deposit toward the total cost of the program is due at the time of application. *

Fee: $5,008

*The remaining fees are due no later than 45 days prior to departure. If you receive financial aid, you can defer payment until disbursement. Deferment decisions will be based on the amount of aid to be received.

What’s included:

  • Tuition for 6 UF GPA credits
  • Housing
  • Welcome and farewell meals
  • Course-related tours
  • Local bus pass
  • Course material packets
  • International health insurance
  • Emergency medical assistance

 What’s not included:

  • Round-trip airfare, meals
  • Additional personal travel
  • Personal expenses

REQUIREMENTS

·         Undergraduate & graduate engineers, 3EG and above
·         Minimum 3.0 GPA
·         Resume
·         Instructor approval

For more information leave us your details

 

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